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The
FINEPLACER® Pico is FINETECH's most versatile base module. It can
be used in a wide field of application for reflow/rework (Pico
Rework Station) and different kinds of micro assembly, e.g. Flip
Chip and Die bonding (Pico Micro Assembly).
On one hand, the Pico MA offers highest accuracy [5 µm (0.2 mil)
placement accuracy], allowing bonding of the smallest die with a
pitch of down to 50 µm. The machine is capable of reworking all
types of SMT components (BGA, QFN, connectors, QFP, SOIC, etc.).
All established reflow and bonding methods can be executed.
Moreover, FINETECH keeps pace with new technical developments,
resulting in continuous upgrading of existing features and
development of most up to date new process modules.
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