The
new FINEPLACER® FEMTO provides auto-touchdown and die placement, as
well as controlled bonding operation after automatic alignment of
die and substrate. The FINEPLACER® FEMTO is an innovative
opto-bonder that offers extreme modularity and flexibility.
With a high placement accuracy of ±0.5 µm, FINEPLACER® FEMTO
is the ideal choice for advanced placement and bonding of power
lasers, laser bars, assembly of opto-electronic components and more.
This versatile system is capable of different bonding technologies,
including flip chip (thermocompression, ultrasonic, AuSn and In),
dispensing, UV curing, fluxing, ACF and ACP. The system works
completely operator-independent, providing stability and increased
process safety for production environments.
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